H. Balkan

Current-crowding-induced electromigration failure in flip chip solder joints

Everett C. C. Yeh, Woon‐Seop Choi, K. N. Tu et al. · Applied Physics Letters · 2002 · 363 citations

Engineering, Electrical Engineering, Materials Science +17

Interfacial Microstructure Evolution Between Eutectic SnAgCu Solder and Al/Ni(V)/Cu Thin Films

M. Li, F. Zhang, W. T. Chen et al. · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 92 citations

Natural Sciences, Materials Engineering, Materials Science +10

Effect of Ag content on the microstructure development of Sn-Ag-Cu interconnects

Henry Y. Lu, H. Balkan, K. Y. Simon Ng · Journal of Materials Science Materials in Electronics · 2006 · 48 citations

Natural Sciences, Materials Engineering, Materials Science +15

Electromigration of flip chip solder bump on Cu/Ni(V)/Al thin film under bump metallization

Woon‐Seop Choi, Everett C. C. Yeh, K. N. Tu et al. · 2003 · 39 citations

Engineering, Electrical Engineering, Materials Science +17

Embedded capacitors in the next generation processor

Yongki Min, Reynaldo Olmedo, Michael J. Hill et al. · 2013 · 26 citations

Engineering, Computer Engineering, Electrical Engineering +14