Gabe Guevara

Low Temperature Cu Interconnect with Chip to Wafer Hybrid Bonding

Guilian Gao, Laura Mirkarimi, Thomas Workman et al. · 2019 · 63 citations

Engineering, Materials Engineering, Materials Science +16

Scaling Package Interconnects Below 20µm Pitch with Hybrid Bonding

Guilian Gao, Laura Mirkarimi, G. G. Fountain et al. · 2018 · 39 citations

Engineering, Manufacturing Engineering, Microfabrication +16

Die to Wafer Stacking with Low Temperature Hybrid Bonding

Guilian Gao, Thomas Workman, Cyprian Uzoh et al. · 2020 · 39 citations

Engineering, Manufacturing Engineering, Materials Science +17

Development of Low Temperature Direct Bond Interconnect Technology for Die-To-Wafer and Die-To-Die Applications-Stacking, Yield Improvement, Reliability Assessment

Guilian Gao, Laura Mirkarimi, Thomas Workman et al. · 2018 · 30 citations

Engineering, Materials Engineering, Materials Science +17

Chip to Wafer Hybrid Bonding with Cu Interconnect: High Volume Manufacturing Process Compatibility Study

Guilian Gao, P. Mrozek, Thomas Workman et al. · 2019 · 29 citations

Engineering, Manufacturing Engineering, Materials Engineering +13