Daniel Redfield

Investigation of the Impact of Pad Surface Texture from Different Pad Conditioners on the CMP Performance

Aniruddh J. Khanna, Mayu Yamamura, Veera Raghava Kakireddy et al. · ECS Journal of Solid State Science and Technology · 2020 · 32 citations

Engineering, Cmp Performance, Mechanical Engineering +16

Soft Chemical Mechanical Polishing Pad for Oxide CMP Applications

Nandan Baradanahalli Kenchappa, R. Popuri, Ashwin Chockkalingam et al. · ECS Journal of Solid State Science and Technology · 2021 · 27 citations · Full text

Materials Science, Materials Engineering, Chemical Engineering +12

Engineering Surface Texture of Pads for Improving CMP Performance of Sub-10 nm Nodes

Aniruddh J. Khanna, Veera Raghava Kakireddy, Jason Fung et al. · ECS Journal of Solid State Science and Technology · 2020 · 25 citations

Impact of Pad Material Properties on CMP Performance for Sub-10nm Technologies

Aniruddh J. Khanna, Raghava Kakireddy, Puneet Jawali et al. · ECS Journal of Solid State Science and Technology · 2019 · 23 citations · Full text

Cmp Performance, Engineering, Mechanical Engineering +22

Methodology for pad conditioning sweep optimization for advanced nodes

Aniruddh J. Khanna, Puneet Jawali, Daniel Redfield et al. · Microelectronic Engineering · 2019 · 11 citations

Numerical Analysis, Large-scale Global Optimization, Engineering +6