Nandan Baradanahalli Kenchappa

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Active since

2020

Affiliations

Applied Materials (United States)(Current)

Nandan Baradanahalli Kenchappa is an author at Applied Materials (United States) specializing in surface roughness, materials science, and materials processing.

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Publications per year

2020–2021

Publications

Investigation of the Impact of Pad Surface Texture from Different Pad Conditioners on the CMP Performance

Aniruddh J. Khanna, Mayu Yamamura, Veera Raghava Kakireddy et al. · ECS Journal of Solid State Science and Technology · 2020 · 32 citations

Engineering, Materials Engineering, Materials Science +17

Soft Chemical Mechanical Polishing Pad for Oxide CMP Applications

Nandan Baradanahalli Kenchappa, R. Popuri, Ashwin Chockkalingam et al. · ECS Journal of Solid State Science and Technology · 2021 · 29 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Engineering Surface Texture of Pads for Improving CMP Performance of Sub-10 nm Nodes

Aniruddh J. Khanna, Veera Raghava Kakireddy, Jason Fung et al. · ECS Journal of Solid State Science and Technology · 2020 · 25 citations

Engineering, Materials Engineering, Materials Science +17

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