H. Frémont

Vibration test and simulation of printed circuit board

F. Arabi, A. Guédon-Gracia, Jean-Yves Delétage et al. · 2018 · 19 citations

Engineering, Mechanical Engineering, Modal Analysis +16

Dynamic void formation in a DD-copper-structure with different metallization geometry

Kirsten Weide-Zaage, David Dalleau, Y. Danto et al. · Microelectronics Reliability · 2006 · 13 citations

Materials Science, Materials Engineering, Engineering +10

Improved physical understanding of intermittent failure in continuous monitoring method

W.C. Maia Filho, M. Brizoux, H. Frémont et al. · Microelectronics Reliability · 2006 · 13 citations

Reliability, Reliability Engineering, Engineering +12

Migration induced material transport in Cu–Sn IMC and SnAgCu microbumps

L. Meinshausen, Kirsten Weide-Zaage, H. Frémont · Microelectronics Reliability · 2011 · 12 citations

Materials Science, Material Transport, Electromigration Technique +6

Study of JEDEC B-condition JESD22-B111 standard for drop test reliability of Chip Scale Packages

Yassine Bentata, S. Forster, Kim Yong Goh et al. · 2008 · 11 citations

Engineering, Measurement, Education +25