M. Brizoux

Thermo-mechanical simulation of PCB with embedded components

W. Kpobie, M. Martiny, S. Mercier et al. · Microelectronics Reliability · 2016 · 28 citations

Engineering, Mechanical Engineering, Embedded Components +8

Optimization of PCB build-up layer configuration for electronic assemblies with active embedded components in the board

W.C. Maia Filho, M. Brizoux, Arnaud Grivon · 2010 · 18 citations · Full text

Engineering, Mechanical Engineering, Electronic Design +19

Improved physical understanding of intermittent failure in continuous monitoring method

W.C. Maia Filho, M. Brizoux, H. Frémont et al. · Microelectronics Reliability · 2006 · 13 citations

Reliability, Reliability Engineering, Engineering +12

Cyclic mechanical behaviour of Sn3.0Ag0.5Cu alloy under high temperature isothermal ageing

B. Dompierre, Véronique Aubin, Éric Charkaluk et al. · Materials Science and Engineering A · 2011 · 13 citations

Materials Engineering, Materials Science, Engineering +9

Solder Joint Loading Conditions under Torsion Test

W.C. Maia Filho, M. Brizoux, H. Frémont et al. · EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems · 2006 · 12 citations

Accelerated Test, Shear Strains, Structural Integrity +14