Concepedia
Microelectronics Reliability · 2011 · 12 citations · 14 references
Materials ScienceMaterial TransportElectromigration TechniqueEngineeringDiffusion ResistanceNanotechnologyApplied PhysicsTransport PhenomenaMicrostructure
14
Crystal Lattice Defects
Physics Today · 1962 · 698 citations
Engineering, Crystalline Defects, Physics +7
Whisker and Hillock formation on Sn, Sn–Cu and Sn–Pb electrodeposits
W. J. Boettinger, C. E. Johnson, L.A. Bendersky et al. · Acta Materialia · 2005 · 320 citations
Materials Science, Engineering, Surface Electrochemistry +6
Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples
H. Gan, K. N. Tu · Journal of Applied Physics · 2005 · 264 citations · Full text
Engineering, Imc Formation, Cu Electrodes +16
Diffusion Parameters and Growth Mechanism of Phases in the Cu-Sn System
Aloke Paul, C. Ghosh, W. J. Boettinger · Metallurgical and Materials Transactions A · 2011 · 166 citations
Materials Engineering, Materials Science, Engineering +10
Dynamic magnetomechanical properties of Terfenol-D/epoxy pseudo 1-3 composites
Siu Wing Or, Tongle Li, H.L.W. Chan · Journal of Applied Physics · 2005 · 147 citations
Magnetic Properties, Engineering, Mechanical Engineering +16