Diffusion Parameters and Growth Mechanism of Phases in the Cu-Sn System

The evaluation of data obtained with diffusion couples of binary single-phase and multiphase systems

Carl Wagner · Acta Metallurgica · 1969 · 636 citations

Natural Sciences, Chemistry, Materials Science +16

Kinetics of interfacial reaction in bimetallic CuSn thin films

K. N. Tu, R. D. Thompson · Acta Metallurgica · 1982 · 468 citations

Natural Sciences, Materials Engineering, Materials Science +14

Interstitial Diffusion of Copper in Tin

B. F. Dyson, T. R. Anthony, David Turnbull · Journal of Applied Physics · 1967 · 382 citations

Natural Sciences, Materials Engineering, Materials Science +6

Diffusion and the Kirkendall shift in binary alloys

J. R. Manning · Acta Metallurgica · 1967 · 298 citations

Natural Sciences, Materials Engineering, Materials Science +14

Prediction of phase formation sequence and phase stability in binary metal-aluminum thin-film systems using the effective heat of formation rule

R. Pretoriüs, A. M. Vredenberg, F.W. Saris et al. · Journal of Applied Physics · 1991 · 290 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +15