Concepedia

Milind Shah

MS

4

Publications

87

Citations

4

H-Index

1998

Active since

Affiliations

Qualcomm (United States)(Current)

Milind Shah is an author at Qualcomm (United States) specializing in materials science, electronic packaging, and engineering.

Top concepts

Publications per year

1998–2018

4

Publications

4

Mechanical properties of Pb/Sn Pb/In and Sn‐In solders

W. Kinzy Jones, Yanqing Liu, Milind Shah et al. · Soldering and Surface Mount Technology · 1998 · 35 citations

, , +14

CuBOL (Cu-column on BOL) technology: A low cost flip chip solution scalable to high I/O density, fine bump pitch and advanced Si-nodes

S. Movva, Steve Bezuk, Omar Bchir et al. · 2011 · 30 citations

, , +20

Thermal compression bonding for fine pitch solder interconnects

Jie Fu, Manuel Aldrete, Milind Shah et al. · 2015 · 11 citations

Study of Polyimide in Chip Package Interaction for Flip-Chip Cu-Pillar Packages

Wei Wang, Dingyou Zhang, Yangyang Sun et al. · 2018 · 11 citations

, , +18

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