2
Publications
25
Citations
2
H-Index
2015
Active since
Affiliations
Manuel Aldrete is an author at Qualcomm (United States) specializing in electronic packaging, computer engineering, and geometric modeling.
Top concepts
EngineeringSolid MechanicsNatural SciencesGeometry ModelingModel CalibrationComputer EngineeringElectronic PackagingComputer-aided DesignComputational GeometryMechanical Engineering
Publications per year
2015–2015
2
2
Relative and absolute warpage modeling on molded packages
Jiantao Zheng, Eric Zhou, Lejun Wang et al. · 2015 · 14 citations
Engineering, Mechanical Engineering, Computer-aided Design +18
Thermal compression bonding for fine pitch solder interconnects
Jie Fu, Manuel Aldrete, Milind Shah et al. · 2015 · 11 citations
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