A. Schmitz

Self-heat reliability considerations on Intel's 22nm Tri-Gate technology

C. Prasad, Lei Jiang, D. Singh et al. · 2013 · 84 citations

Engineering, Computer Engineering, Electrical Engineering +17

A 32nm SoC platform technology with 2<sup>nd</sup> generation high-k/metal gate transistors optimized for ultra low power, high performance, and high density product applications

C.-H. Jan, M. Agostinelli, Markus J. Buehler et al. · 2009 · 77 citations

Engineering, Computer Engineering, Electrical Engineering +17

Reliability of dual-damascene local interconnects featuring cobalt on 10 nm logic technology

Flavio Griggio, J. Palmer, Fuxiang Pan et al. · 2018 · 60 citations

Engineering, Electrical Engineering, Materials Science +17

Low-k interconnect stack with metal-insulator-metal capacitors for 22nm high volume manufacturing

D. Ingerly, Ankur Agrawal, Ricardo Ascázubi et al. · 2012 · 49 citations

Engineering, Materials Engineering, Materials Science +13

Reliability Characteristics of a High Density Metal- Insulator-Metal Capacitor on Intel’s 10+ Process

Che-Yun Lin, Uygar E. Avci, M. A. Blount et al. · 2020 · 17 citations

Engineering, Computer Engineering, Electrical Engineering +12