Arnaud Garnier

IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management

Pascal Vivet, Èric Guthmuller, Yvain Thonnart et al. · IEEE Journal of Solid-State Circuits · 2020 · 118 citations · Full text

Artificial Intelligence, Engineering, Vlsi Design +26

Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures

P. Coudrain, P. Chausse, L. Arnaud et al. · 2019 · 63 citations

Engineering, Successful Structural Test, Computer Architecture +16

2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm² Inter-Chiplet Interconnects and 156mW/mm²@ 82%-Peak-Efficiency DC-DC Converters

Pascal Vivet, Èric Guthmuller, Yvain Thonnart et al. · 2020 · 60 citations

Engineering, Vlsi Design, Energy Efficiency +16

System in package embedding III-V chips by fan-out wafer-level packaging for RF applications

Arnaud Garnier, Laetitia Castagné, F. Greco et al. · 2021 · 18 citations

Plasma FIB: Enlarge your field of view and your field of applications

Arnaud Garnier, Giuseppe Filoni, Tomáš Hrnčíř et al. · Microelectronics Reliability · 2015 · 15 citations

Plasma Fib, Space Plasma Physics, Engineering +2