V. Arunachalam

Interfacial reactions during sputter deposition of Ta and TaN films on organosilicate glass: XPS and TEM results

Justin Wilks, N.P. Magtoto, Jeffry A. Kelber et al. · Applied Surface Science · 2007 · 61 citations

Materials Science, Interfacial Reactions, Chemical Engineering +9

Integrated multi-scale model for ionized plasma physical vapor deposition

V. Arunachalam, Shahid Rauf, Daniel G. Coronell et al. · Journal of Applied Physics · 2001 · 22 citations

Engineering, Plasma Physics, Integrated Circuits +19

Ion solid surface interactions in ionized copper physical vapor deposition

X.-Y Liu, Murray S. Daw, Joel D. Kress et al. · Thin Solid Films · 2002 · 19 citations

Materials Science, Engineering, Surface Science +5

Low resistivity tungsten for 32nm node MOL contacts and beyond

Filippos Papadatos, Keith H.K. Wong, V. Arunachalam et al. · Microelectronic Engineering · 2011 · 15 citations

Materials Science, Materials Engineering, Electrical Engineering +9

A high density 0.10 μm CMOS technology using low K dielectric and copper interconnect

Shivendra Singh Parihar, M. Angyal, B. Boeck et al. · 2002 · 15 citations

Engineering, Vlsi Design, Computer Architecture +18