L. Ciampolini

Modelling thermal effects of large contiguous voids in solder joints

L. Ciampolini, Mauro Ciappa, P. Malberti et al. · Microelectronics Journal · 1999 · 49 citations

Quantitative carrier profiling in ion-implanted 6H–SiC

Filippo Giannazzo, L. Calcagno, V. Raineri et al. · Applied Physics Letters · 2001 · 43 citations

Materials Science, Semiconductor Technology, Electrical Engineering +12

Scalable 0.35 V to 1.2 V SRAM Bitcell Design From 65 nm CMOS to 28 nm FDSOI

Fady Abouzeid, Audrey Bienfait, Kaya Can Akyel et al. · IEEE Journal of Solid-State Circuits · 2014 · 24 citations

Non-volatile Memory, Engineering, Vlsi Design +16

A 128 kb 7T SRAM Using a Single-Cycle Boosting Mechanism in 28-nm FD–SOI

Babak Mohammadi, Oskar Andersson, Joseph Nguyen et al. · IEEE Transactions on Circuits and Systems I Regular Papers · 2017 · 24 citations

Low-power Electronics, Single-cycle Boosting Mechanism, Electrical Engineering +15

Simulation of scanning capacitance microscopy measurements on micro-sectioned and bevelled n+–p samples

L. Ciampolini, Filippo Giannazzo, Mauro Ciappa et al. · Materials Science in Semiconductor Processing · 2001 · 21 citations

Materials Science, Engineering, Electron Microscopy +10