Rudolf Schlangen

Non-destructive defect depth determination at fully packaged and stacked die devices using Lock-in Thermography

Christian Schmidt, Frank Altmann, Rudolf Schlangen et al. · 2010 · 39 citations

Engineering, Electrical Engineering, Microelectromechanical Systems +15

Physical Techniques for Chip-Backside IC Debug in Nanotechnologies

Christian Boit, Rudolf Schlangen, U. Kerst et al. · IEEE Design & Test of Computers · 2008 · 25 citations

Engineering, Computer Engineering, Electrical Engineering +17

Dynamic lock-in thermography for operation mode-dependent thermally active fault localization

Rudolf Schlangen, Hervé Deslandes, Ted Lundquist et al. · Microelectronics Reliability · 2010 · 20 citations

Engineering, Computer Engineering, Systems Engineering +14

Use of Lock-In Thermography for Non-Destructive 3D Defect Localization on System in Package and Stacked-Die Technology

Rudolf Schlangen, Shinobu Motegi, Toshi Nagatomo et al. · Proceedings - International Symposium for Testing and Failure Analysis · 2011 · 19 citations

Engineering, Electrical Engineering, Microelectronics +14

Impact of back side circuit edit on active device performance in bulk silicon ICs

Christian Boit, U. Kerst, Rudolf Schlangen et al. · 2006 · 17 citations

Engineering, Computer Engineering, Electrical Engineering +12