Rudolf Schlangen

Non-destructive defect depth determination at fully packaged and stacked die devices using Lock-in Thermography

Christian Schmidt, Frank Altmann, Rudolf Schlangen et al. · 2010 · 38 citations

Engineering, Measurement, Education +21

Physical Techniques for Chip-Backside IC Debug in Nanotechnologies

Christian Boit, Rudolf Schlangen, U. Kerst et al. · IEEE Design & Test of Computers · 2008 · 23 citations

Engineering, Constant Innovations, Hardware Security +22

Dynamic lock-in thermography for operation mode-dependent thermally active fault localization

Rudolf Schlangen, Hervé Deslandes, Ted Lundquist et al. · Microelectronics Reliability · 2010 · 20 citations

Fault Diagnosis, Reliability Engineering, Engineering +7

Use of Lock-In Thermography for Non-Destructive 3D Defect Localization on System in Package and Stacked-Die Technology

Rudolf Schlangen, Shinobu Motegi, Toshi Nagatomo et al. · Proceedings - International Symposium for Testing and Failure Analysis · 2011 · 19 citations

Engineering, Advanced Packaging (Semiconductors), Calibration +16

Impact of back side circuit edit on active device performance in bulk silicon ICs

Christian Boit, U. Kerst, Rudolf Schlangen et al. · 2006 · 17 citations

Engineering, Vlsi Design, Side Editing +16