Heino Henke

High-Frequency Modeling of TSVs for 3-D Chip Integration and Silicon Interposers Considering Skin-Effect, Dielectric Quasi-TEM and Slow-Wave Modes

Ivan Ndip, Brian Curran, Kai Löbbicke et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 151 citations

Engineering, Electrical Engineering, Microelectronics +16

Broadband Microstrip Antenna With Left-Handed Metamaterials

Merih Palandöken, Andre Grede, Heino Henke · IEEE Transactions on Antennas and Propagation · 2009 · 136 citations

Engineering, Electrical Engineering, Antennas +16

Analytical, Numerical-, and Measurement–Based Methods for Extracting the Electrical Parameters of Through Silicon Vias (TSVs)

Ivan Ndip, Kai Zoschke, Kai Löbbicke et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 84 citations

Engineering, Electrical Engineering, Microelectronics +16

Analytical Models for Calculating the Inductances of Bond Wires in Dependence on their Shapes, Bonding Parameters, and Materials

Ivan Ndip, Abdurrahman Öz, H. Reichl et al. · IEEE Transactions on Electromagnetic Compatibility · 2014 · 45 citations

Engineering, Electrical Engineering, Materials Science +17

Modeling, Quantification, and Reduction of the Impact of Uncontrolled Return Currents of Vias Transiting Multilayered Packages and Boards

Ivan Ndip, Florian Ohnimus, Kai Löbbicke et al. · IEEE Transactions on Electromagnetic Compatibility · 2010 · 44 citations

Engineering, Electrical Engineering, Microelectronics +16