R. Döring

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Publications

Citations

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Active since

1999

Affiliations

Fraunhofer Institute for Electronic Nano Systems(Current)

Fraunhofer Institute for Reliability and Microintegration

Robert Bosch (Germany)

R. Döring is an author at Fraunhofer Institute for Electronic Nano Systems specializing in electronic packaging, mechanics of materials, and electrical engineering.

Top concepts

EngineeringMicrostructureMaterial ScienceElectronic PackagingElectrical EngineeringMechanical EngineeringMechanics Of MaterialsSolid MechanicsMicroelectronicsReliability Engineering

Publications per year

1999–2018

Publications

Combined experimental- and FE-studies on sinter-Ag behaviour and effects on IGBT-module reliability

R. Dudek, R. Döring, Peter Sommer et al. · 2014 · 30 citations

Engineering, Mechanical Engineering, Power Electronics +23

Fatigue Life Prediction and Analysis of Wafer Level Packages with SnAgCu Solder Balls

R. Dudek, Sven Rzepka, Stephan Dobritz et al. · 2006 1st Electronic Systemintegration Technology Conference · 2006 · 23 citations

Engineering, Mechanical Engineering, Mesh Densities +20

Electro-thermo-mechanical analyses on silver sintered IGBT-module reliability in power cycling

R. Dudek, R. Döring, Sven Rzepka et al. · 2015 · 16 citations

Do chip size limits exist for DCA?

Andreas Schubert, R. Dudek, R. Leutenbauer et al. · 1999 · 11 citations

Engineering, Mechanical Engineering, Computer Architecture +17

Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue

R. Dudek, Martin Hildebrand, Sven Rzepka et al. · Microelectronics Reliability · 2018 · 10 citations

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