Concepedia

M. Konarski

MK

Statistics

Publications

6

Citations

105

H-Index

6

Active since

1979

Affiliations

Auburn University(Current)

M. Konarski is an author at Auburn University specializing in engineering, materials engineering, and chip packaging.

Publications per year

1979–2003

6

Publications

6

Underfilling fine pitch BGAs

Haiwei Peng, Wayne Johnson, George T. Flowers et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2001 · 26 citations

Engineering, Electrical Engineering, Materials Engineering +13

Processing and reliability of CSPs with underfill

J. Liu, Wayne Johnson, E. Yaeger et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2003 · 23 citations

Engineering, Materials Engineering, Manufacturing Processes +14

Static Performance of Vectoring/Reversing Nonaxisymmetric Nozzles

C. M. Willard, F. J. Capone, M. Konarski et al. · Journal of Aircraft · 1979 · 16 citations

Engineering, Aerospace Engineering, Mechanical Engineering +15

Lead-free solder flip chip-on-laminate assembly and reliability

Zhenwei Hou, Guoyun Tian, C. Hatcher et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2001 · 15 citations

Engineering, Materials Engineering, Materials Science +15

Low cost flip chip processing and reliability of fast-flow, snap-cure underfills

Paul N. Houston, D.F. Baldwin, M. Deladisma et al. · 2003 · 13 citations

Engineering, Materials Engineering, Materials Science +13

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