Concepedia

E. Yaeger

EY

Statistics

Publications

2

Citations

35

H-Index

2

Active since

2003

Affiliations

Auburn University(Current)

E. Yaeger is an author at Auburn University specializing in chip packaging, manufacturing processes, and capillary flow.

Publications per year

2003–2003

2

Publications

2

Processing and reliability of CSPs with underfill

J. Liu, Wayne Johnson, E. Yaeger et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2003 · 23 citations

, , +14

Processing of fluxing underfills for flip chip-on-laminate assembly

Renzhe Zhao, Wayne Johnson, George R. Jones et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2003 · 12 citations

, , +14

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