Concepedia
Statistics
Publications
3
Citations
36
H-Index
Active since
2003
Affiliations
Auburn University(Current)
Henkel (United States)
Renzhe Zhao is an author at Auburn University specializing in engineering, materials science, and materials processing.
Publications per year
2003–2004
Wafer-Applied Underfill: Flip-Chip Assembly and Reliability
Wayne Johnson, Qing Wang, Fei Ding et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2004 · 13 citations
Engineering, Manufacturing Engineering, Materials Science +15
Processing of fluxing underfills for flip chip-on-laminate assembly
Renzhe Zhao, Wayne Johnson, George R. Jones et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2003 · 12 citations
Engineering, Materials Engineering, Materials Science +14
Kinetic modeling of no-flow underfill cure and its relationship to solder wetting and voiding
J.M. Hurley, T. Berfield, S. Ye et al. · 2003 · 11 citations
Engineering, Materials Engineering, Materials Science +13
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