Zhenwei Hou

Flip Chip Assembly of Thinned Silicon Die on Flex Substrates

Wayne Johnson, Tan Zhang, Zhenwei Hou et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2008 · 62 citations

Engineering, Mechanical Engineering, Biomedical Engineering +18

Flexible Electronics: Thin Silicon Die on Flexible Substrates

Tan Zhang, Zhenwei Hou, Wayne Johnson et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2009 · 40 citations

Engineering, Thin Film Process Technology, Silicon On Insulator +16

Ultra-thin, flexible electronics

Brian Holland, Ryan McPherson, Tan Zhang et al. · 2008 · 23 citations

Engineering, Biomedical Engineering, Die Flip Chip +17

Lead-free solder flip chip-on-laminate assembly and reliability

Zhenwei Hou, Guoyun Tian, C. Hatcher et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2001 · 15 citations

Materials Science, Engineering, Advanced Packaging (Semiconductors) +11

Recovery and Reuse of Waste PVC Coated Fabrics. Part 2: Analysis of the Components Separated from PVC Coated PET Fabrics

Sabit Adanur, Zhenwei Hou, R. M. Broughton · Journal of Coated Fabrics · 1998 · 13 citations

Materials Science, Chemical Engineering, Engineering +12