Concepedia

Guoyun Tian

GT

4

Publications

83

Citations

4

H-Index

2001

Active since

Affiliations

Auburn University(Current)

Guoyun Tian is an author at Auburn University specializing in materials science, engineering, and mechanical engineering.

Top concepts

EngineeringMaterial ScienceHeat TransferElectronic PackagingMechanical EngineeringMicroelectronicsThermal EngineeringRheology3D PrintingNanomaterials

Publications per year

2001–2005

4

Publications

4

Corner bonding of CSPs: processing and reliability

Guoyun Tian, Yueli Liu, Wayne Johnson et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2005 · 37 citations

Materials Science, Materials Engineering, Chip-scale Package +15

Nano-Underfills for High-Reliability Applications in Extreme Environments

Pradeep Lall, Saiful Islam, Jeff Suhling et al. · 2005 · 20 citations

Engineering, Material Innovation, Extreme Environments +16

Lead-free solder flip chip-on-laminate assembly and reliability

Zhenwei Hou, Guoyun Tian, C. Hatcher et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2001 · 15 citations

Materials Science, Engineering, Advanced Packaging (Semiconductors) +11

Kinetic modeling of no-flow underfill cure and its relationship to solder wetting and voiding

J.M. Hurley, T. Berfield, S. Ye et al. · 2003 · 11 citations

Materials Science, No-flow Underfill Cure, Kinetic Modeling +15

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