Concepedia

Paul N. Houston

PN

Statistics

Publications

4

Citations

54

H-Index

4

Active since

2003

Affiliations

Georgia Institute of Technology(Current)

Paul N. Houston is an author at Georgia Institute of Technology specializing in manufacturing processes, materials engineering, and chip packaging.

Publications per year

2003–2019

4

Publications

4

Comprehensive comparative analysis of microstructure of Sn–Ag–Cu (SAC) solder joints by traditional reflow and thermo-compression bonding (TCB) processes

Jinho Hah, Youngja Kim, Patxi Fernandez-Zelaia et al. · Materialia · 2019 · 21 citations

Natural Sciences, Materials Engineering, Materials Science +14

Low cost flip chip processing and reliability of fast-flow, snap-cure underfills

Paul N. Houston, D.F. Baldwin, M. Deladisma et al. · 2003 · 13 citations

Engineering, Materials Engineering, Materials Science +13

Design, processing and reliability characterizations of a 3D-WLCSP packaged component

Zhaozhi Li, Paul N. Houston, Daniel F. Baldwin et al. · 2009 · 10 citations

Engineering, Design, Manufacturing Engineering +15

Flux-underfill compatibility and failure mode analysis in high yield flip chip processing

Paul N. Houston, D.F. Baldwin, Wei-En Tsai · 2003 · 10 citations

Engineering, Manufacturing Engineering, Materials Engineering +17

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