Concepedia

Zhaozhi Li

ZL

Statistics

Publications

2

Citations

32

H-Index

2

Active since

2009

Affiliations

Auburn University(Current)

Zhaozhi Li is an author at Auburn University specializing in three-dimensional integration, advanced packaging, and chip packaging.

Publications per year

2009–2021

2

Publications

2

Scaling Solder Micro-Bump Interconnect Down to $10\ \mu\mathrm{m}$ Pitch for Advanced 3D IC Packages

Zhaozhi Li, Yoshihiro TOMITA, Adel Elsherbini et al. · 2021 · 22 citations

, , +17

Design, processing and reliability characterizations of a 3D-WLCSP packaged component

Zhaozhi Li, Paul N. Houston, Daniel F. Baldwin et al. · 2009 · 10 citations

, , +15

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