Karin Hauck

A single layer negative tone lift-off photo resist for patterning a magnetron sputtered Ti/Pt/Au contact system and for solder bumps

Anja Voigt, Marina Heinrich, Karin Hauck et al. · Microelectronic Engineering · 2005 · 32 citations

Materials Science, Materials Engineering, Electrical Engineering +11

Wafer Bonding with BCB and SU-8 for MEMS Packaging

Maik Wiemer, Chenping Jia, Michael Toepper et al. · 2006 1st Electronic Systemintegration Technology Conference · 2006 · 24 citations

Engineering, Mechanical Engineering, Wafer Scale Processing +16

Alternative UBM for Lead Free Solder Bumping using C4NP

Klaus Ruhmer, Eric Laine, Kathy O’Donnell et al. · 2007 · 12 citations

Materials Engineering, Materials Science, Electrical Engineering +14

Phased array calibration and diagnostics utilizing a student-built planar near-field system

John T. Logan, D. Reinhard, Karin Hauck · 2010 · 10 citations

Printing Solder Paste in Dry Film - A Low Cost Fine-Pitch Bumping Technique

Tobias Baumgartner, Dionysios Manessis, Michael J. Topper et al. · 2007 · 10 citations

Materials Science, Bump Pitch, Electrical Engineering +13