Chenping Jia

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Active since

2006

Affiliations

Fraunhofer Institute for Electronic Nano Systems(Current)

Chemnitz University of Technology

Franche-Comté Électronique Mécanique Thermique et Optique - Sciences et Technologies

Chenping Jia is an author at Fraunhofer Institute for Electronic Nano Systems specializing in microfabrication, applied physics, and microelectronics.

Top concepts

EngineeringApplied PhysicsMaterial ScienceMicroelectronicsMicrofabricationElectronic PackagingElectrical EngineeringOpticsMicroscopy3D Printing

Publications per year

2006–2015

Publications

Wafer Bonding with BCB and SU-8 for MEMS Packaging

Maik Wiemer, Chenping Jia, Michael Toepper et al. · 2006 1st Electronic Systemintegration Technology Conference · 2006 · 24 citations

Engineering, Mechanical Engineering, Wafer Scale Processing +16

Eutectic wafer bonding for 3-D integration

Mario Baum, Chenping Jia, Marco Haubold et al. · 2010 · 20 citations

Engineering, Eutectic Wafer, Key Factors +16

Wafer-Level Fabrication of Microcube-Typed Beam-Splitters by Saw-Dicing of Glass Substrate

Maciej Barański, Sylwester Bargiel, Nicolas Passilly et al. · IEEE Photonics Technology Letters · 2013 · 14 citations

Engineering, Microscopy, Glass Substrates +21

Micro-optical design of a three-dimensional microlens scanner for vertically integrated micro-opto-electro-mechanical systems

Maciej Barański, Sylwester Bargiel, Nicolas Passilly et al. · Applied Optics · 2015 · 10 citations

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