Statistics
Publications
2
Citations
157
H-Index
2
Active since
2018
Affiliations
Indian Institute of Packaging(Current)
Chandrasekhar Mandalapu is an author at Indian Institute of Packaging specializing in chip packaging, interconnect technology, and packaging design.
Publications per year
2018–2022
2
2
Scaling Package Interconnects Below 20µm Pitch with Hybrid Bonding
Guilian Gao, Laura Mirkarimi, G. G. Fountain et al. · 2018 · 39 citations
Engineering, Manufacturing Engineering, Microfabrication +16
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