Statistics
Publications
3
Citations
176
H-Index
3
Active since
2009
Eva Leong Ching Wai is an author at Institute of Microelectronics specializing in microelectronics, interconnect technology, and through-silicon via packaging.
Publications per year
2009–2020
3
3
Tai Chong Chai, Xiaowu Zhang, John H. Lau et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 55 citations
Engineering, Electrical Engineering, Electronic Materials +16
Fan-Out Wafer Level Packaging Development Line
Tc Chai, David Ho, Sc Chong et al. · 2020 · 12 citations
Engineering, Automotive Engineering, Manufacturing Processes +14
1–3 of 3