J. Ackaert

Finite-Element Simulation of Different Kinds of Wafer Warpages: Spherical, Cylindrical, and Saddle

Aditi Mallik, Roger Stout, J. Ackaert · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 47 citations

Engineering, Mechanical Engineering, Residual Stress +23

Plasma-Charging Damage of Floating MIM Capacitors

Z. Wang, J. Ackaert, Cora Salm et al. · IEEE Transactions on Electron Devices · 2004 · 23 citations · Full text

Strategies to cope with plasma charging damage in design and layout phases

Z. Wang, J. Ackaert, A. Scarpa et al. · 2005 · 14 citations

Electrical Engineering, Plasma Electronics, Engineering +12

Prevention of plasma induced damage on thin gate oxide of HDP oxide deposition, metal etch, Ar preclean processing in BEOL sub-half micron CMOS processing

J. Ackaert, E. De Backer, P. Coppens et al. · 2002 · 13 citations

Materials Science, Electrical Engineering, Engineering +15

Correlation between hot carrier stress, oxide breakdown and gate leakage current for monitoring plasma processing induced damage on gate oxide

J. Ackaert, Zhichun Wang, E. De Backer et al. · 2003 · 11 citations

Hc Stress, Engineering, Hot Carrier Stress +16