Roger Stout

Finite-Element Simulation of Different Kinds of Wafer Warpages: Spherical, Cylindrical, and Saddle

Aditi Mallik, Roger Stout, J. Ackaert · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 49 citations

Engineering, Manufacturing Engineering, Mechanical Engineering +14

Evaluation of isothermal and isoflux natural convection coefficient correlations for utilization in electronic package level thermal analysis

B.A. Zahn, Roger Stout · 2002 · 46 citations

Engineering, Computational Engineering, Mechanical Engineering +17

A novel low cost 25μm thin exfoliated monocrystalline Si solar cell technology

R. A. Rao, L. Mathew, Sayan Saha et al. · 2011 · 42 citations

Engineering, Electrical Engineering, Materials Science +17

A 100 nm copper/low-k bulk CMOS technology with multi Vt and multi gate oxide integrated transistors for low standby power, high performance and RF/analog system on chip applications

G.C.-F. Yeap, J. Chen, Piotr Grudowski et al. · 2003 · 21 citations

Engineering, Computer Engineering, Electrical Engineering +17

How to extend a thermal-RC-network model (derived from experimental data) to respond to an arbitrarily fast input

Roger Stout, D. Billings · 2002 · 17 citations

Engineering, Electrical Engineering, Microelectronics +16