K. H. R. Kirmse - Concepedia

Author

K. H. R. Kirmse

Texas Instruments (United States)

Also Known As

K. H. R. Kirmse, K. Kirmse, K.H. Kirmse, K.H.R. Kirmse, Karen H. R. Kirmse, Karen Kirmse

Publications

244

Citations

H-Index

Concepts

All Affiliations

Texas Instruments (United States)University of Wisconsin–Madison The University of Texas at Dallas University of Maryland, College Park

About

K. H. R. Kirmse is an author at Texas Instruments (United States) specializing in applied physics, engineering, and microelectronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	10	11	226
2	Applied Physics	10	10	204
3	Natural Sciences	2	2	45
4	Chemistry	2	2	88
5	Chemical Engineering	1	1	33

K. H. R. Kirmse

Publications

237

Citations

H-Index

Page 1

	Year	Citations
Study of C4F8/N2 and C4F8/Ar/N2 plasmas for highly selective organosilicate glass etching over Si3N4 and SiC Xuefeng Hua, Xiang Wang, Daphne A. Fuentevilla, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films Materials EngineeringMaterials ScienceN2 AdditionEngineeringSurface Science	2003	55
SiO2 to Si selectivity mechanisms in high density fluorocarbon plasma etching K. H. R. Kirmse, A. Wendt, Sabrina Disch, Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena EngineeringSi Selectivity MechanismsGlow DischargeVacuum DeviceChemistry	1996	33
Mechanisms for polycrystalline silicon defect passivation by hydrogenation in an electron cyclotron resonance plasma E. S. Cielaszyk, K. H. R. Kirmse, Rodney A. Stewart, Applied Physics Letters Electrical EngineeringIon ImplantationEngineeringPhysicsCrystalline Defects	1995	26
A 65 nm CMOS technology for mobile and digital signal processing applications A. Chattedee, J. Yoon, Song Zhao, Low-power ElectronicsHardware SecurityElectrical EngineeringEngineeringVlsi Design	2005	22
Experiments with back side gas cooling using an electrostatic wafer holder in an electron cyclotron resonance etching tool J. A. Meyer, K. H. R. Kirmse, J.-S. Jenq, Applied Physics Letters EngineeringLiquid Metal CoolingElectron Cyclotron ResonanceVacuum DeviceRefrigeration	1994	17
Mask undercut in deep silicon etch Iqbal Saraf, Matthew Goeckner, Brian Goodlin, Applied Physics Letters EngineeringPhysicsMask UndercutApplied PhysicsFilm Growth	2011	15
Fluorocarbon high density plasmas. VIII. Study of the ion flux composition at the substrate in electron cyclotron resonance etching processes using fluorocarbon gases K. H. R. Kirmse, A. Wendt, G. S. Oehrlein, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films EngineeringPhysicsApplied PhysicsIon Flux CompositionNeutral Fluorine	1994	14
Spectral scatterometry for 2D trench metrology of low-K dual-damascene interconnect Vladimir A. Ukraintsev, Mak Kulkarni, Christopher C. Baum, Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE EngineeringMicroscopyOptical TestingInterferometryElectron Microscopy	2002	12
Study of C4F8/CO and C4F8/Ar/CO plasmas for highly selective etching of organosilicate glass over Si3N4 and SiC Ling Li, Xin‐Min Hua, X. Li, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films	2004	11
Ion energy control at substrates during plasma etching of patterned structures Rardchawadee Silapunt, A. Wendt, K. H. R. Kirmse Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena EngineeringElectron-beam LithographyPatterned StructuresTailored Bias VoltagePlasma Processing	2007	11

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