K. H. R. Kirmse

Study of C4F8/N2 and C4F8/Ar/N2 plasmas for highly selective organosilicate glass etching over Si3N4 and SiC

Xuefeng Hua, Xiang Wang, Daphne A. Fuentevilla et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2003 · 55 citations

Materials Engineering, Materials Science, N2 Addition +13

SiO2 to Si selectivity mechanisms in high density fluorocarbon plasma etching

K. H. R. Kirmse, A. Wendt, Sabrina Disch et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 1996 · 33 citations

Engineering, Si Selectivity Mechanisms, Glow Discharge +21

Mechanisms for polycrystalline silicon defect passivation by hydrogenation in an electron cyclotron resonance plasma

E. S. Cielaszyk, K. H. R. Kirmse, Rodney A. Stewart et al. · Applied Physics Letters · 1995 · 26 citations · Full text

Electrical Engineering, Ion Implantation, Engineering +13

A 65 nm CMOS technology for mobile and digital signal processing applications

A. Chattedee, J. Yoon, Song Zhao et al. · 2005 · 22 citations

Low-power Electronics, Hardware Security, Electrical Engineering +14

Experiments with back side gas cooling using an electrostatic wafer holder in an electron cyclotron resonance etching tool

J. A. Meyer, K. H. R. Kirmse, J.-S. Jenq et al. · Applied Physics Letters · 1994 · 17 citations

Engineering, Liquid Metal Cooling, Electron Cyclotron Resonance +17