C. Lee is an author at Siemens (Singapore) specializing in electronic packaging, materials engineering, and mechanical engineering.
Top concepts
EngineeringMaterial ScienceElectronic PackagingMaterials EngineeringMechanical EngineeringCorrosionChemical EngineeringRecycling3D PrintingFood Packaging
Publications per year
1999–2002
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Investigation on the effect of copper leadframe oxidation on package delamination
Chai Tai Chong, A. Leslie, Lim Thiam Beng et al. · 2002 · 52 citations
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