Fu Luo

A review: research progress of chemical–mechanical polishing slurry for copper interconnection of integrated circuits

Han Yan, Xinhuan Niu, Minghui Qu et al. · The International Journal of Advanced Manufacturing Technology · 2023 · 58 citations

Materials Science, Copper Interconnection, Chemical Engineering +8

Effect of hydroxy carboxylates as complexing agent on improving chemical mechanical polishing performance of M-plane sapphire and action mechanism analysis

Minghui Qu, Xinhuan Niu, Ziyang Hou et al. · Ceramics International · 2022 · 24 citations

Materials Science, Materials Engineering, Chemical Engineering +9

Effect and mechanism analysis of sarcosine on the chemical mechanical polishing performance of copper film for GLSI

Yinchan Zhang, Xinhuan Niu, Jiakai Zhou et al. · Materials Science in Semiconductor Processing · 2022 · 21 citations

Materials Science, Materials Engineering, Chemical Engineering +10

Synergistic effect of 1,2,4-triazole and phytic acid as inhibitors on copper film CMP for ruthenium - based copper interconnected and the surface action mechanism analysis

Fu Luo, Xinhuan Niu, Han Yan et al. · Materials Science in Semiconductor Processing · 2022 · 21 citations

Inorganic Chemistry, Chemical Engineering, Synergistic Effect +9

Multi-Scale Insight into Inhibition Mechanism of Benzo Derivatives in Chemical Mechanical Polishing of Copper Film Based on Experiments and Theoretical Calculations

Jianghao Liu, Xinhuan Niu, Ni Zhan et al. · ECS Journal of Solid State Science and Technology · 2023 · 19 citations · Full text

Engineering, Copper Film, Chemistry +21