Ni Zhan

A review: research progress of chemical–mechanical polishing slurry for copper interconnection of integrated circuits

Han Yan, Xinhuan Niu, Minghui Qu et al. · The International Journal of Advanced Manufacturing Technology · 2023 · 58 citations

Materials Science, Copper Interconnection, Chemical Engineering +8

Corrosion inhibition mechanisms of triazole derivatives on copper chemical mechanical polishing: Combined experiment and DFT study

Jianghao Liu, Xinhuan Niu, Yingqian Jia et al. · Applied Surface Science · 2024 · 49 citations

Materials Science, Chemical Engineering, Corrosion Protection +9

Chemical mechanical polishing for copper films in integrated circuit wiring layers using an advanced slurry

Jianghao Liu, Xinhuan Niu, Yingqian Jia et al. · Tribology International · 2024 · 25 citations

Materials Science, Materials Engineering, Electrical Engineering +13

Chemical-mechanical synergies effects of multi-purpose pH regulators on C-, A-, and R-plane sapphire polishing

Yida Zou, Xinhuan Niu, Ni Zhan et al. · Tribology International · 2024 · 21 citations

Materials Science, Materials Engineering, Chemical Engineering +11

Multi-Scale Insight into Inhibition Mechanism of Benzo Derivatives in Chemical Mechanical Polishing of Copper Film Based on Experiments and Theoretical Calculations

Jianghao Liu, Xinhuan Niu, Ni Zhan et al. · ECS Journal of Solid State Science and Technology · 2023 · 19 citations · Full text

Engineering, Copper Film, Chemistry +21