J.C. Ondrusek

Stress-induced voiding under vias connected to wide Cu metal leads

E.T. Ogawa, J. W. McPherson, J. Rosal et al. · 2003 · 150 citations

Natural Sciences, Materials Engineering, Materials Science +15

Cosmic ray neutron induced upsets as a major contributor to the soft error rate of current and future generation DRAMs

W.R. McKee, H. McAdams, E.B. Smith et al. · 1996 · 56 citations

Engineering, Computer Engineering, Physics +13

Product drift from NBTI: Guardbanding, circuit and statistical effects

Anand Krishnan, Frank Cano, C. Chancellor et al. · 2010 · 43 citations

Engineering, Computer Engineering, Electrical Engineering +17

Use of Scanning Electron Microscopy and Energy Dispersive X-Ray Analysis (SEM-EDXA) in Identification of Foreign Material on Bullets

VJM DiMaio, S. S. Dana, J.C. Ondrusek · Journal of Forensic Sciences · 1987 · 26 citations

Medicine, Criminology, Materials Science +14

Effective kinetic variations with stress duration for multilayered metallizations

J.C. Ondrusek, A. Nishimura, Takashi Sugiura et al. · 2003 · 24 citations

Natural Sciences, Materials Engineering, Materials Science +15