K. H. Kelleher

Tantalum as a diffusion barrier between copper and silicon: Failure mechanism and effect of nitrogen additions

Karen Holloway, P. M. Fryer, C. Cabral et al. · Journal of Applied Physics · 1992 · 448 citations

Engineering, Materials Engineering, Materials Science +17

Dependence of the Al<i>x</i>Ga1−<i>x</i>As band edge on alloy composition based on the absolute measurement of <i>x</i>

T. F. Kuech, D. J. Wolford, R. M. Potemski et al. · Applied Physics Letters · 1987 · 139 citations

Natural Sciences, Materials Engineering, Materials Science +15

Incommensurate structure in the Bi-Sr-Ca-Cu-O 80-K superconductor

T. M. Shaw, S. A. Shivashankar, S. J. La Placa et al. · Physical review. B, Condensed matter · 1988 · 124 citations

Natural Sciences, Materials Science, Physics +12

Electromigration in Al/W and Al(Cu)/W Interconnect Structures

C-K. Hu, Paul S. Ho, M. B. Small et al. · MRS Proceedings · 1991 · 16 citations

Engineering, Electrical Engineering, Materials Engineering +12

Crystal growth and characterization of the superconducting phase in the BiSrCuO system

P. Strobel, K. H. Kelleher, F. Holtzberg et al. · Physica C Superconductivity · 1988 · 13 citations

Natural Sciences, Materials Science, Physics +14