K. C. Ting

Wafer-Level Integration of an Advanced Logic-Memory System Through the Second-Generation CoWoS Technology

S. Y. Hou, W. Chris Chen, Clark Hu et al. · IEEE Transactions on Electron Devices · 2017 · 216 citations

Engineering, Computer Engineering, Electrical Engineering +15

A 16nm FinFET CMOS technology for mobile SoC and computing applications

Shien-Yang Wu, Chi-Hsien Lin, M.C. Chiang et al. · 2013 · 148 citations

Engineering, Computer Engineering, Electrical Engineering +17

Wafer Level System Integration of the Fifth Generation CoWoS®-S with High Performance Si Interposer at 2500 mm2

P. K. Huang, Chin‐Wei Lu, Wen-En Wei et al. · 2021 · 91 citations

Engineering, Computer Engineering, High-performance Computing +17

An enhanced 16nm CMOS technology featuring 2<sup>nd</sup> generation FinFET transistors and advanced Cu/low-k interconnect for low power and high performance applications

Shien-Yang Wu, C.Y. Lin, M.C. Chiang et al. · 2014 · 62 citations

Engineering, Computer Engineering, Electrical Engineering +17

Integrated Deep Trench Capacitor in Si Interposer for CoWoS Heterogeneous Integration

S. Y. Hou, Harry Hsia, Chung-Hsien Tsai et al. · 2019 · 55 citations

Engineering, Electrical Engineering, High-performance Computing +17