Sairam Agraharam

Plasma chemistry in fluorocarbon film deposition from pentafluoroethane/argon mixtures

Sairam Agraharam, Dennis W. Hess, Paul A. Kohl et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1999 · 67 citations

Chemical Engineering, Engineering, Nonthermal Plasma +12

Copper Die Bumps (First Level Interconnect) and Low-K Dielectrics in 65nm High Volume Manufacturing

A. Yeoh, Ming Chang, C. Pelto et al. · 2006 · 61 citations

Engineering, High Volume, Copper Die Bumps +18

Comparison of plasma chemistries and structure-property relationships of fluorocarbon films deposited from octafluorocyclobutane and pentafluoroethane monomers

Sairam Agraharam, Dennis W. Hess, Paul A. Kohl et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2001 · 23 citations

Engineering, Organic Chemistry, Chemistry +16

Thermal Stability of Fluorocarbon Films Deposited from Pentafluoroethane/Argon Plasmas

Sairam Agraharam, Dennis W. Hess, Paul A. Kohl et al. · Journal of The Electrochemical Society · 2000 · 22 citations

Materials Science, Chemical Engineering, Engineering +15

Low-K Interconnect Stack with Thick Metal 9 Redistribution Layer and Cu Die Bump for 45nm High Volume Manufacturing

D. Ingerly, Sairam Agraharam, D. Becher et al. · 2008 · 19 citations

Engineering, Vlsi Design, Computer Architecture +23