E. Sprogis

Three-dimensional silicon integration

John Knickerbocker, Paul Andry, B. Dang et al. · IBM Journal of Research and Development · 2008 · 493 citations

Engineering, Electrical Engineering, Manufacturing Engineering +17

Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection

John Knickerbocker, Paul Andry, L.P. Buchwalter et al. · IBM Journal of Research and Development · 2005 · 236 citations

Engineering, Computer Engineering, Electrical Engineering +17

3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias

John Knickerbocker, C.S. Patel, Paul Andry et al. · IEEE Journal of Solid-State Circuits · 2006 · 185 citations

Engineering, Computer Engineering, Electrical Engineering +15

Wafer-level 3D integration technology

Steven J. Koester, Anthony Young, R. Yu et al. · IBM Journal of Research and Development · 2008 · 177 citations

Engineering, Manufacturing Engineering, Computer-integrated Manufacturing +15

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections

Katsuyuki Sakuma, Paul Andry, Cornelia Tsang et al. · IBM Journal of Research and Development · 2008 · 163 citations

Engineering, Manufacturing Engineering, Manufacturing Processes +16