J. A. Fair

Properties of low-pressure CVD tungsten silicide for MOS VLSI interconnections

Krishna C. Saraswat, Dominik Brors, J. A. Fair et al. · IEEE Transactions on Electron Devices · 1983 · 113 citations

Engineering, Integrated Circuits, Silicon On Insulator +18

Low and high coverage determinations of the rate of carbon monoxide adsorption and desorption from Pt(110)

J. A. Fair, R. J. Madix · The Journal of Chemical Physics · 1980 · 93 citations

Engineering, Chemistry, Molecular Dynamics +22

X-ray photoemission spectra of reactively sputtered TiN

M. Delfino, J. A. Fair, D. Hodul · Journal of Applied Physics · 1992 · 63 citations

Materials Science, Materials Engineering, X-ray Crystallography +15

Correlation of electrical resistivity and grain size in sputtered titanium films

M. E. Day, M. Delfino, J. A. Fair et al. · Thin Solid Films · 1995 · 54 citations

Temperature dependence of the electrical resistivity of reactively sputtered TiN films

W. Tsai, M. Delfino, J. A. Fair et al. · Journal of Applied Physics · 1993 · 49 citations

Engineering, Temperature Dependence, Thin Film Process Technology +18