Paul Martin Smith

Chemical additives for improved copper chemical vapour deposition processing

John A. T. Norman, David A. Roberts, Arthur K. Hochberg et al. · Thin Solid Films · 1995 · 51 citations

Materials Science, Chemical Engineering, Copper Oxide Materials +5

Chemical vapor deposition of titanium–silicon–nitride films

Paul Martin Smith, Jonathan S. Custer · Applied Physics Letters · 1997 · 47 citations

Materials Science, Chemical Engineering, Engineering +11

W-B-N diffusion barriers for Si/Cu metallizations

J.S. Reid, R.Y. Liu, Paul Martin Smith et al. · Thin Solid Films · 1995 · 42 citations

Materials Science, W-b-n Diffusion Barriers, Materials Engineering +6

Enhanced Chemical Vapor Deposition of Copper from  ( hfac ) Cu (  TMVS  )  Using Liquid Coinjection of TMVS

Gary A. Petersen, J. E. Parmeter, C. Apblett et al. · Journal of The Electrochemical Society · 1995 · 30 citations

Materials Science, Chemical Engineering, Engineering +11

Growth and properties of W–Si–N diffusion barriers deposited by chemical vapor deposition

J. G. Fleming, E. Roherty‐Osmun, Paul Martin Smith et al. · Thin Solid Films · 1998 · 27 citations

Materials Science, Engineering, Surface Science +5