Arthur K. Hochberg

A new metal-organic chemical vapor deposition process for selective copper metallization

John A. T. Norman, B.A. Muratore, Paul N. Dyer et al. · Materials Science and Engineering B · 1993 · 51 citations

Natural Sciences, Materials Engineering, Materials Science +8

Chemical additives for improved copper chemical vapour deposition processing

John A. T. Norman, David A. Roberts, Arthur K. Hochberg et al. · Thin Solid Films · 1995 · 51 citations

Engineering, Materials Engineering, Materials Science +12

The dynamics of bubblers as vapor delivery systems

Allen Love, Stanley Middleman, Arthur K. Hochberg · Journal of Crystal Growth · 1993 · 42 citations

Engineering, Chemical Engineering, Mechanical Engineering +6

MOCVD of high-k dielectrics, tantalum nitride and copper from directly injected liquid precursors

Yoshihide Senzaki, Arthur K. Hochberg, John A. T. Norman · Advanced Materials for Optics and Electronics · 2000 · 28 citations

Natural Sciences, Materials Engineering, Materials Science +17

The Origin of Nonuniform Growth of LPCVD Films from Silane Gas Mixtures

Andrew Yeckel, Stanley Middleman, Arthur K. Hochberg · Journal of The Electrochemical Society · 1989 · 23 citations

Engineering, Materials Engineering, Materials Science +17