Influence of La2O3 nanoparticle additions on microstructure, wetting, and tensile characteristics of Sn–Ag–Cu alloy

References

Page 1

	Year	Citations
Lead-free Solders in Microelectronics Mulugeta Abtew, Guna S Selvaduray Materials Science and Engineering R Reports Electrical EngineeringMiniaturizationEngineeringAdvanced Packaging (Semiconductors)Nanoelectronics	2000	1.9K
Six cases of reliability study of Pb-free solder joints in electronic packaging technology Ke Zeng, K. N. Tu Materials Science and Engineering R Reports ReliabilityElectrical EngineeringReliability EngineeringEngineeringReliability Study	2002	1.3K
Dislocation generation due to differences between the coefficients of thermal expansion Richard Arsenault, Nai Shi Materials Science and Engineering EngineeringSevere Plastic DeformationPhysicsDislocation InteractionMechanics	1986	1.1K
Strengthening in carbon nanotube/aluminium (CNT/Al) composites Raji George, K. T. Kashyap, Rohit Rahul, Scripta Materialia Materials ScienceReinforcement MaterialMetal Matrix CompositeComposite TechnologyCarbon Nanotube/aluminium	2005	779
Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints K.S. Kim, Seok‐Hwan Huh, Katsuaki Suganuma Journal of Alloys and Compounds Materials EngineeringMaterials ScienceFriction WeldingIntermetallic CompoundsEngineering	2003	607
An analysis of the factors affecting strengthening in carbon nanotube reinforced aluminum composites Srinivasa Rao Bakshi, Arvind Agarwal Carbon Materials ScienceReinforcement MaterialMetal Matrix CompositeEngineeringComposite Technology	2010	492
Properties and deformation behaviour of Mg–Y2O3 nanocomposites Chee Leok Goh, Jianfeng Wei, L LEE, Acta Materialia Materials ScienceMaterials EngineeringEngineeringMagnesium-based CompositeMg–y2o3 Nanocomposites	2007	469
Effects of cooling speed on microstructure and tensile properties of Sn–Ag–Cu alloys K.S Kim, Seok‐Hwan Huh, Katsuaki Suganuma Materials Science and Engineering A Materials EngineeringMaterials ScienceEngineeringMechanical EngineeringTensile Properties	2002	374
Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu T. Y. Lee, Woon‐Seop Choi, K. N. Tu, Journal of materials research/Pratt's guide to venture capital sources Materials ScienceEngineeringPb-free SoldersApplied PhysicsMetallurgical Interaction	2002	252
Simultaneous enhancement in strength and ductility by reinforcing magnesium with carbon nanotubes C.S. Goh, Jianfeng Wei, L.C. Lee, Materials Science and Engineering A Materials ScienceEngineeringMechanical PropertiesCorrosionMechanical Engineering	2006	245

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