Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates

Abstract

Abstract Heterogeneous integration on flexible substrates has been explored in recent years to meet the high‐performance and flexible form factors requirements of several emerging applications. Reliable interconnects, in both 2D and 3D layouts, are critical for the effective use of these systems. But it is challenging to employ conventional bonding and interconnect technology due to considerable mismatches in mechanical and thermal properties. For example, the ultra‐thin chips (UTCs) are too fragile to withstand the static or oscillating forces applied during conventional bonding. In this regard, printing of metal tracks on flexible substrates is a promising alternative to access the contact pads on integrated circuits (ICs), as the interconnects on diverse substrates can be realized at room temperature processing using as much materials as needed. Further, it is easier to attain step coverage. Considering the above attractive features, and the challenges associated with conventional bonding techniques, this article focuses on the development of high‐resolution printing interconnects in both 2D and 3D layouts and explores various printing routes available for high density integration. The article also discusses major conventional interposers/interconnects forming methods and their limitations for flexible hybrid electronics along with few examples of printed interconnects to highlight the opportunities for future.