Investigation of isothermal aged Sn-3Ag-0.5Cu/Sn58Bi-Co hybrid solder joints on ENIG and ENEPIG substrate with various mechanical performances

Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions

A.A. El-Daly, A.E. Hammad, A. Fawzy et al. · Materials & Design (1980-2015) · 2012 · 156 citations

Natural Sciences, Materials Engineering, Materials Science +16

Recent advances in nano-materials for packaging of electronic devices

Shuye Zhang, Xiangyu Xu, Tiesong Lin et al. · Journal of Materials Science Materials in Electronics · 2019 · 147 citations

Natural Sciences, Materials Engineering, Materials Science +14

Challenges and recent prospectives of 3D heterogeneous integration

Shuye Zhang, Zhenfeng Li, Hongzhi Zhou et al. · e-Prime - Advances in Electrical Engineering Electronics and Energy · 2022 · 133 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +17

Equilibrium phase diagram design and structural optimization of SAC/Sn-Pb composite structure solder joint for preferable stress distribution

Sunwu Xu, Xinyi Jing, Pengyu Zhu et al. · Materials Characterization · 2023 · 113 citations

Engineering, Materials Engineering, Materials Science +17

The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface

Shaoan Wang, Xiangyu Chen, Keyu Luo et al. · Journal of Materials Research and Technology · 2023 · 97 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +15