Concepedia

Qingyang Qiu

QQ

Statistics

Publications

2

Citations

23

H-Index

2

Active since

2024

Affiliations

Harbin Institute of Technology(Current)

Korea Advanced Institute of Science and Technology

Qingyang Qiu is an author at Harbin Institute of Technology specializing in package-level reliability, packaging design, and package design.

Publications per year

2024–2024

2

Publications

2

Incomplete dissolved behavior and mechanical analysis of SnAgCu-SnBi composite solder structures for high-reliable package-on-package techniques

Shuai Zhang, Shuai Zhang, Xinyi Jing et al. · Materials Characterization · 2024 · 13 citations

, , +14

Investigation of isothermal aged Sn-3Ag-0.5Cu/Sn58Bi-Co hybrid solder joints on ENIG and ENEPIG substrate with various mechanical performances

Shuai Zhang, Shuai Zhang, Qingyang Qiu et al. · Materials Today Communications · 2024 · 10 citations

, , +12

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