Thermal layout optimization for 3D stacked multichip modules

3-D Thermal-ADI: a linear-time chip level transient thermal simulator

Ting-Yuan Wang, Charlie Chung‐Ping Chen · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 2002 · 239 citations

Engineering, Computer Engineering, Electrical Engineering +17

IC thermal simulation and modeling via efficient multigrid-based approaches

Peng Li, Lawrence T. Pileggi, Mehdi Asheghi · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 2006 · 95 citations

Engineering, Computational Engineering, Computer Engineering +17

Heat and fluid flow in entrance region of a channel with staggered baffles

Sepehr Mousavi, Kamel Hooman · Energy Conversion and Management · 2006 · 93 citations

Natural Sciences, Mechanical Engineering, Physics +16

IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging

Wen‐Hwa Chen, Ching-Feng Yu, Hsien‐Chie Cheng et al. · Microelectronics Reliability · 2012 · 84 citations

Engineering, Materials Engineering, Materials Science +10

Power Blurring: Fast Static and Transient Thermal Analysis Method for Packaged Integrated Circuits and Power Devices

Amirkoushyar Ziabari, Je-Hyoung Park, Ehsan K. Ardestani et al. · IEEE Transactions on Very Large Scale Integration (VLSI) Systems · 2014 · 75 citations

Engineering, Computer Engineering, Electrical Engineering +17