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A stacked SONOS technology, up to 4 levels and 6nm crystalline nanowires, with Gate-All-Around or independent gates (φ-Flash), suitable for full 3D integration
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References
2009
Year
Unknown Venue
EngineeringDevice IntegrationNanodevicesEmerging Memory TechnologyCrystalline NanowiresIntegrated Circuits3D MemorySemiconductorsMultilevel OperationFull 3DNanoelectronicsMemory Device3D Ic ArchitectureElectrical EngineeringNanoscale SystemSonos Memory ArchitectureNanotechnologyComputer EngineeringMicroelectronicsApplied PhysicsQuantum DevicesSemiconductor MemoryStacked Sonos TechnologyNm Nanowires3D Integration
We present the first experimental study of a Gate-All-Around (GAA) SONOS memory architecture with 4-level crystalline nanowire channels (down to 6 nm-diameter). The technology is also extended to an independent double gate memory architecture, called Φ-Flash. The experimental results with 6 nm nanowires show high programming windows (up to 7.4 V), making the structure compatible with multilevel operation. Excellent retention even after 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">4</sup> cycles is achieved. The independent double gate option has otherwise been successfully integrated with 4-level stacked nanowires for multibit applications. The Φ-Flash exhibits up to 1.8 V ΔV <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">Th</sub> between its two gates, demonstrating multibits operation. The basic process to fully disconnect the different nanowires in view of a full 3D integration of a memory array is discussed.
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