IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1995 · 20 citations · 6 references
EngineeringHigh-performance ComputingMechanical EngineeringComputer ArchitectureHeat TransferThermal AnalysisCooling SystemsHeat ConductionHeat ExchangersRefrigerationThermal DesignThermal ManagementAir-cooled Heat ExchangersAir-cooled MachinesAir-to-air Heat ExchangersCooling System DesignCooling TechniquesDirect Water CoolingHeat Exchanger DesignHigh Performance
This paper provides a perspective and review of the evolution of high performance cooling technology that has been developed and used in IBM medium and large-scale computers over the past 25 years. Package cooling technology and its evolution, leading to the development of the thermal conduction module (TCM) is described. The development of air cooling technology is discussed; along with enhancements using turbulators, air-to liquid heat exchangers, and impinging flow. The development of water cooling and direct liquid immersion technology is also covered.
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