Creep behavior of the ternary 95.5Sn-3.9Ag-0.6Cu solder—Part I: As-cast condition

Mechanical fatigue characteristics of Sn-3.5Ag-X (X=Bi, Cu, Zn and In) solder alloys

Yoshiharu Kariya, Masahisa Otsuka · Journal of Electronic Materials · 1998 · 161 citations

Natural Sciences, Materials Engineering, Materials Science +14

The effect of soldering process variables on the microstructure and mechanical properties of eutectic Sn-Ag/Cu solder joints

Wenge Yang, L.E. Felton, Robert W. Messler · Journal of Electronic Materials · 1995 · 151 citations

Natural Sciences, Materials Engineering, Materials Science +13

Creep behavior of eutectic Sn–Ag lead-free solder alloy

Mingliang Huang, Liming Wang, Chi‐Man Lawrence Wu · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 91 citations

Natural Sciences, Materials Engineering, Materials Science +12

Time-independent mechanical and physical properties of the ternary 95.5Sn-3.9Ag-0.6Cu solder

Paul T. Vianco, Jerome A. Rejent, Alice C. Kilgo · Journal of Electronic Materials · 2003 · 68 citations

Natural Sciences, Materials Engineering, Materials Science +13

Time-dependent deformation behavior of near-eutectic 60Sn-40Pb solder

J.J. Stephens, D. R. Frear · Metallurgical and Materials Transactions A · 1999 · 44 citations

Natural Sciences, Materials Engineering, Materials Science +14